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Specialist, Microelectronics Advanced Packaging Designer

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L3Harris Technologies

2024-09-30 13:39:47

Job location Palm Bay, Florida, United States

Job type: fulltime

Job industry: Manufacturing Operations

Job description

Job Title: Specialist, Microelectronics Advanced Packaging Designer - Tapeout

Job Code: 16329

Job Location: Palm Bay, FL

Job Schedule: 9/80 (Every other Friday off!)

Relocation: Relocation assistance is available to qualified applicants!

Job Description:

The L3Harris Space and Airborne Systems Microelectronics organization is expanding our in-house advanced packaging research and development efforts and capabilities. As a member of our dynamic and collaborative environment, you will be responsible for working with EDA tools to solve challenging layout problems at the silicon level.

Essential Functions:

  • Write and modify DRC and LVS rule deck in PVS or Calibre for silicon tapeout.
  • Write Cadence SKILL routines for Virtuoso, APD, and general programming.
  • Develop custom checks as needed for verification and robustness.
  • Work with GDS and OAS file formats and translators.
  • Work closely with advanced packaging design team to improve design tools and submit bug findings and improvement recommendations.
  • Adapt to an evolving process and work closely with teammates providing up-to-date changes.
Qualifications:
  • Bachelor's Degree in Electrical Engineering and a minimum of 4 years of prior related experience. Graduate Degree or equivalent with 2 years of prior related experience. In lieu of a degree, minimum of 8 years of prior related experience
  • Experience with hierarchical design editing in EDA tools including Virtuoso, K-Layout, and/or L-Edit
  • Professional knowledge of coding in Python and/or MATLAB
  • Experience with foundry design rules encompassing minimum line widths, spaces, angles, and degassing
  • Professional knowledge of 3D layouts
Preferred Additional Skills:
  • Existing TS/SCI Clearance or ability to obtain one

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